Name: rigid-flex printed circuit board China Manufacturer
Brand: Shenzhen HDI Circuit Boards,PCBA assembly,Components Sourcing,IC Substrate PCB manufacturer, Shenzhen Dickson Circuit CO.,LTD
SKU: Flex pcb 9999
Availability: InStock
Rating: 5 (1 reviews)

Home > Flex & Rigid Circuit Boards > Flex-Rigid PCB > rigid-flex printed circuit board China Manufacturer

Description Flex Fab Steps Rigid Flexible Circuit Capability

Description

Flexible PCB

Flexible PCB is also called flexible printed circuit boards or FPCB. Compared with ordinary hard resin circuit boards, the flexible circuit board has the advantages of high wiring density, lightweight, thin thickness, less wiring space limitation, and high flexibility.

It adapts to the needs of today's electronic products towards the direction of high density and high reliability, miniaturization and lightweight. Meanwhile, flex PCB also meets the strict economic requirements and the need for market and technology competition.

Flexible circuits are also used extensively in other applications and industries including:

Communications

Consumer Electronics

Automotive

Medical

Industrial

Aerospace

Military

Transportation

Flex Fab Steps

Flex Fab Steps
Step 1:Apply ADhesive/Seed coat

Apply an epoxy or acrylic adhesive, or use sputtering to create a thin copper layer for plated bonds. lamination of roll-annealed copper as an alternative.

Step 2: Add Copper Foil

Add copper foil by laminating to an adhesive (the more mainstream method) or electroless plating onto a seed layer. New manufacturing processes from material suppliers allow the use of adhesive-free.

Step 3: Drill holes

Holes for vias and pads are usually mechanically drilled. Multiple plated flexible substrates can be drilled simultaneously by combining them from multiple reels on a drum, drilling between work plates, and rolling out to separate reels on the other side of the drill. Precut flexible panels can be bonded and drilled between rigid blanks in the same way that rigid cores are drilled, but it requires more careful registration and alignment accuracy is reduced. For ultra-small holes, laser drilling can be used, but the cost increases significantly because each layer of film must be drilled individually. Excimer (UV) or YAG (IR) laser machines are used for higher precision (micropores), CO2 lasers are used for mesopores (4+ mils). Large holes and cuts require drilling, but this is a separate step.

Step 4: Through Hole Plating

Once the holes are drilled, the copper is deposited and electrolessly plated in the same manner as the rigid PCB core (often called Cuposit). It is recommended that through-hole plating thickness in flex circuits be at least 1 mil to add mechanical support to the pad or via, while a typical low-cost rigid PCB may only have a ½ mil plating thickness.

Step 5: Resist Etch Print

A photoresist is applied to the surface of the film and using the desired mask pattern, the resist is exposed and formed prior to chemical etching of the copper.

Step 6: Etch and Strip

After etching the exposed copper, the etch resist is chemically stripped from the flex circuit.

Step 7: Overlay

The top and bottom areas of the flexible circuit are protected by a covering layer that is cut and shaped. There may be components that are actually mounted on the portion of the flex circuit, in which case the overlay also acts as a solder mask. The most common overlay material is an attached polyimide film with an adhesive, but adhesive-free processes are also available. In the adhesiveless process, a photo-imaged solder mask (the same used on the rigid circuit board portion) is used to essentially print the overlay onto the flexible circuit. For rougher, less expensive designs, screen printing is also an option, with the overcoat ultimately cured by UV exposure. Basically, the difference is that overlays are laminated films, whereas overlays apply a coating of material that then needs to be cured.

Step 8: Cut off the flex board
The final step in creating a flex circuit is to cut it off. This is often called "blanking." The cost-effective method of blanking high volumes is via hydraulic punch and die sets, which involve considerable tooling costs. However, this method can punch out many flex circuits simultaneously. For prototypes and low-volume runs, use a blanking knife. A die cutter is simply a long blade that is bent into the shape of the flex circuit outline and fixed into a routing groove on the backing board (MDF, plywood, or a thick plastic like Teflon). The flexible loop is then pressed into a punch cutter and cut.

Rigid Flexible Circuit Capability

1-10 layer	lexible layers (multiple flex layers in either bonded or air gap configuration)
1-40 layer	rigid layers
2-50 layer	layer rigid flexible circuits
Flex Core Materials	Polyimide (PI):1/2 mil to 4 mils in either adhesive or adhesives constructions
Copper thickness	1/3 OZ – 2 OZ RA or ED type (insert material/copper-foil.htm) in flexible circuit; 1/2OZ to 10 OZ in rigid circuits
Coverlays	1/2 mil to 2 mils polyimide
Stiffeners material	polyimide, FR4, stainless steel, aluminum
Rigid Materials	130, 170, 180 TG FR4, low flow prepreg
Controlled impedance	50 ohm, 90 Ohm, 100 Ohm, 110 Ohm and other value
Surface finishing	ENIG, ENEPIG, gold plating, gold fingers (3-30u” Au), Immersion silver

Dickson Circuit Co.,Ltd has a 17 year history of producing high frequency PCB.
We cooperates with many well-known companies such as Samsung, Osram, Philips, and China Southern Power Grid.
The quality is guaranteed and the price is very affordable.
Just give me a Gerber file, and I will definitely give you a satisfactory product.

If you are interested, please feel free to contact me at any time.

Mikro

Email: Mikro@dicksoncircuit.com

Tel: +86 137 135 41332

WhatsApp：+86 137 135 41332

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